Assam Startup, Cisco LaunchPad to co-host India Technopreneurship Series
Assam Startup, IIM Calcutta Innovation Park, and CLAP (Cisco LaunchPad Accelerator Program) are jointly hosting the India Technopreneurship Series- Assam Edition for innovators and startups in Assam. The initiative will provide a platform for innovation and collaboration so as to enable nascent companies to solve new-age challenges. The virtual program comprises a series of workshops on business and technology tracks that will play a pivotal role in providing corporate and institutional support to young innovators.
“The series comes to Assam just at the right time catalyzing Assam Startup’s efforts to add vibrancy into an emerging startup ecosystem in the state,” said Pranjal Konwar, COO of IIM Calcutta Innovation Park.
Assam is the second state only to Kerala to have been introduced to this pioneering Series by the networking and software giant.
Registrations can be done at: https://app.smartsheet.com/b/form/cbe8ca2a7fec47278c86333ee03b64c9
The initiative, powered by Cisco LaunchPad offers an invaluable platform for young innovators, early-stage startups, government representatives, corporate leaders, industry mentors and investors to exchange ideas and take a deep dive into the innovative ways of leveraging technologies to solve a gamut of critical new-age problems. With Cisco LaunchPad’s history of propelling startups’ growth in the country, the Technopreneurship Series is expected to unlock new avenues of growth for early-stage startups, aspiring entrepreneurs and student innovators from the region by exposing them to top-class industry mentors, startup enablers and investors, while giving them access to global networking opportunities and monetary incentives.
Following a 5-day workshop under the Series, the participating startups, aspiring entrepreneurs and student innovators will pitch before a panel of corporate leaders and industry experts. The shortlisted startups will get inducted to Cisco’s startup ecosystem for accelerated growth.
